Material & Physical Failure Analysis Engineer

The application window is expected to close on: 6/23/25. Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

This position will be 100% onsite in San Jose, California.

The Cisco Material Science & Failure Analysis (MSFA) team, part of the larger Component, Quality, and Technology group, is a close-knit team with diverse experience and expertise focuses on in-depth root cause analysis investigations. We deliver exceptional failure analysis results to our internal partners. MSFA team is passionate about learning and collaborating with cross-functional teams on new processes and technology development!

As a Senior material & failure analysis engineer, you will play a crucial role in ensuring the quality of Cisco's products by:

• Perform electrical fault isolation of semiconductor components (ASIC) through extensive use of bench tester(s) or automated test equipment.
• Conduct root cause failure analysis investigation of sub-system assembly, components, and PCB.
• Perform hands-on physical and material analysis by effectively using available analytical techniques.
• Perform sample preparation (cross section, chemical & mechanical delayering) of advanced ASIC, PCB, or optical modules.
• Develop novel FA techniques and capabilities to support new technology/product development.
• Build concise failure analysis report with exceptional visualizations and present findings to cross-functional teams.
• Collaborate with hardware, product, process, and component engineer in evaluation of new components and processes.

• BS Degree in Electrical, material, mechanical or chemical engineering or similar, plus 7 or more years of hands-on experience on conducting root cause analysis of PCB assembly or semiconductor devices (ASIC).
• Hands on experience with the following failure analysis tools and techniques: Scanning Electron microscope (SEM and EDX), Scanning Acoustic Microscope (CSAM), real time 2D X-ray, 3D x-ray, parametric analyzer, Thermal/Photo Emission, cross section, de-capsulation and de- processing integrated circuits.
• Experience working with physical sample preparation (cross section, chemical or mechanical de-layering).
• Analytical, problem-solving skills and passion for learning.
• Proven communication skills written and verbal.
• Able to work independently with flexibility to changing priorities.
• Must possess strong desire for hands on work in a lab environment.

• Hands on experience of ASIC debug test setup: dynamic or static fault localization techniques such as LADA/TIVA/LTM/SMI/LVP/PEM/LSI
• Hands on experience with ATE test, test program development or post silicon ASIC validation is a plus.
• Knowledge of semiconductor manufacturing process or assembly SMT process is plus.

At Cisco, we're revolutionizing how data and infrastructure connect and protect organizations in the AI era - and beyond. We've been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Simply put - we power the future.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you'll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.